在地球化学、采矿和环境科学中,精确的化学分析始于有效的样品制备。将岩石、矿石、土壤或沉积物等地质样品粉碎成细小、均匀的粉末对于确保分析的准确性和代表性至关重要。
Retsch 提供完整的仪器组合,专为粉碎工作流程的每个步骤量身定制,从最初的粗碎到超细研磨。凭借久经考验的可靠性、无污染选项和符合国际标准,Retsch 设备可确保您的结果准确且可重复。
Retsch 系统支持符合 ISO 3082:2017 等铁矿石方法,该方法要求完全粉碎至 100%通过 160 μm 。这确保了即使是 0.5 g 子样品也能准确代表数吨异质的地质材料。
Retsch 提供您实验室以值得信赖的精度、效率和质量。从常规样品制备到关键微量元素分析,Retsch 使您的工作更轻松、更快捷、更可靠。这里有一个表格总结了不同的需求:
| Technique & equipment | Function | Input Size | Output size | Notes | |||||
| 1 | Retsch Jaw Crushers(BB Series) |
Coarse crushing rock or coal samples |
Large pieces up to 150 mm |
Gravel (~2mm or even finer, adjustable) |
Hardened steel, NiHard 4 or tungsten carbide jaws; cyclone systems available, aslo combination units with DM 200 from small table top version to 3.5 t/h sample throughput |
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| 2 | Retsch Disc Mills/ (RS 200 / RS 300; DM 200) |
Intermediate to fine grinding |
up to 20 mm | ~20 µm | High-energy,quick pulverization; ideal for XRF sample prep; uses grinding discs/ring and puck up to 2000 ml sample per batch |
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| 3 | Retsch Planetary Ball Mills (PM series) |
Ultra-fine grinding, sub-micron particles possible |
up to 10 mm | <50 µm, even s< 100 nm with wet milling |
Uniform powder; uses prolonged milling; wet milling possible for 8-220 ml sample depending on used jar size |
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| 4 | Retsch Mixer Mills (MM series) |
Quick pulverizing of small samples monts from 1-42 ml |
up to 10 mm | <5 µm, even < 100 nm with wet grinding | Horizontal shaking with ball in jar; ideal for small sample amounts up to 42 ml quick pulverisation or wet grinding down to 100 nm possible |
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| 5 | Non-metal grinding sets (agate/alumina ceramic) |
Avoid contamination for trace element analysis |
Variable | Depends on mill used |
Used when metal contamination is critical |
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多孔材料或细孔的渗透
冶金化验是测定黄金、白银、铂、钯、铱、铑等贵金属含量的标准方法。火试金法(火试金)以其无可比拟的精确度广受认可,甚至能检测低至1 ppb的痕量浓度。尽管该方法具有破坏性,但它仍是冶炼厂和矿业公司进行矿石估值与质量控制最可靠的手段。在工艺起始阶段,高质量的样品均质化至关重要,尤其针对煤、焦炭及坚硬脆性矿石。
这些仪器协同工作,确保获得均匀且具有代表性的样品,这对获得准确且可重复的火试金结果至关重要。
创建标准薄片(粘贴在载玻片上的约 30 μm 厚的岩石或矿物切片)对于在透射光或偏光显微镜下进行检查至关重要。作为地质学的基石技术,薄片可以精细地揭示岩石的矿物成分、微观结构和纹理。QATM 设备支持此薄片制备过程的每个阶段:从初始切片的精密切割,到受控研磨以实现均匀的厚度,再到可选的单面或双面抛光以提高光学清晰度。